Deep Learning-Based Chip Power Prediction and Optimization: An Intelligent EDA Approach

Authors

  • Shikai Wang Electrical and Computer Engineering, New York University, NY, USA
  • Kangming Xu Computer Science and Engineering , Santa Clara University, CA, USA
  • Zhipeng Ling Computer Science, University of Sydney, Sydney, Australia

Keywords:

Deep Learning, Electronic Design Automation, Power Optimization, Generative Adversarial Networks.

Abstract

This paper explores the integration of deep learning techniques in Electronic Design Automation (EDA) tools, focusing on chip power prediction and optimization. We investigate the application of advanced AI technologies, including attention mechanisms, machine learning, and generative adversarial networks (GANs), to address complex challenges in modern chip design. The study examines the transition from traditional heuristic-based methods to data-driven approaches, highlighting the potential for significant improvements in design efficiency and performance. We present case studies demonstrating the effectiveness of AI-driven EDA tools in functional verification, Quality of Results (QoR) prediction, and Optical Proximity Correction (OPC) layout generation. The research also addresses critical challenges, such as model interpretability and the need for extensive empirical validation. Our findings suggest that AI/ML technologies have the potential to revolutionize EDA workflows, enabling more efficient chip designs and accelerating innovation in the semiconductor industry. The paper concludes by discussing future directions, including the integration of quantum computing and neuromorphic architectures in EDA tools. We emphasize the importance of collaborative research between AI experts and chip designers to fully realize the potential of these technologies and address emerging challenges in advanced node designs.

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Published

2024-07-26

How to Cite

[1]
S. Wang, K. Xu, and Z. Ling, “Deep Learning-Based Chip Power Prediction and Optimization: An Intelligent EDA Approach”, IJIRCST, vol. 12, no. 4, pp. 77–87, Jul. 2024.

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